MapleX Communication

Technology

A self-coherent photonic-electronic transmission architecture, bringing coherent technology to a wider range of optical interconnect applications.

Core R&D capabilities

Silicon Photonic Integrated Chip Design

In-house single-wavelength 200G/400G silicon photonic transceiver chips.

High-Speed Analog Chip Design

In-house high-speed analog equalizer chips based on the TSMC 28 nm node.

Silicon Photonics and SOA Packaging

Advanced packaging processes to reduce coupling loss.

200G PON TECHNOLOGY

Stokes Self-Coherent 200G PON Technology

For single-wavelength 200G-class optical access, the architecture coordinates receiver design, optoelectronic integration and system implementation to balance capacity, reach, integration and deployment cost.

01

Stokes vector direct detection

SVDD recovers high-speed optical signals without an independent local oscillator at the receiver.

02

Silicon photonic integration

Silicon photonics supports integrated ONU transceiver modules and burst-mode OLT receiver modules.

03

Single-wavelength 200G-class transmission

Balances capacity, reach, integration and deployment cost for single-wavelength 200G-class transmission.

ANALOG MIMO FFE

High-Speed Analog Equalization Technology

200 Gb/s2×50 GBaud PAM4
12 tapHigh-bandwidth analog FFE
4×2MIMO polarization processing
01

Analog-domain equalization

The high-bandwidth analog FFE completes key equalization before digital processing and supports polarization and chromatic-dispersion compensation.

02

Analog MIMO + IM/DD DSP

Analog MIMO performs front-end equalization before the IM/DD DSP, recovering high-speed signals with a lower digital compute load.

03

Power and cost

To address the high power of digital equalization, the analog approach reduces digital processing pressure and provides a lower-power, lower-cost domestic technology path.

Explore the next step in optical interconnect

Technical exchange and R&D collaboration, shaped by real link requirements.

Contact us ↗